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Bizwit Research & Consulting LLP is a global provider of business intelligence & consulting services. We have a strong primary base of key industry leaders along with the chain of industry analysts to analyze the market trends and its future impact in order to estimates and forecast different business segments and markets. 

With the emergence and long-term Impact of COVID-19, the Global 3D IC Market is to reach USD 51.81 Billion by 2030

Bizwit Research & Consulting LLP’s Recent Analysis on Global 3D IC Market is poised to raise up to USD 51.81 Billion by 2030. 3D IC, or 3D Integrated Circuit, refers to a technology in which multiple semiconductor chips, also known as Integrated Circuits (ICs), are stacked vertically on top of each other to create a three-dimensional structure. This technology is employed in the field of microelectronics and integrated circuit design to overcome some of the limitations of traditional 2D integrated circuits. The 3D IC Market is expanding because of factors such as increasing demand for consumer electronics and growing demand for connected wearable devices.

As a result, the demand for 3D IC has progressively increased in the international market during the forecast period 2023-2030. Consumer electronics, such as smartphones, tablets, and gaming consoles, are continuously striving for improved performance. 3D IC technology allows for faster data transfer, reduced signal delays, and better power efficiency. As consumers demand faster, more powerful, and more energy-efficient devices, manufacturers turn to 3D ICs to meet these requirements. According to Statista, in 2023, the Consumer Electronics market is expected to be worth USD 602.50 billion and estimated to reach up to USD 950.30 billion by 2027 in between 2023-2027 at a rate of 12.07%.

Furthermore, in 2023, consumer electronics retail sales in the United States account for USD 485 billion. Moreover, the rising integration of 3D IC in smart home appliances and the growing adoption of IoT technology is anticipated to create lucrative growth opportunities for the market over the forecast period. However, high costs associated with 3D IC technology and technical complexity are going to impede overall market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global 3D IC Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 owing to the increased demand for integrated circuits due to technological advancements in the region. The region’s dominant performance is anticipated to propel the overall demand for 3D IC. Furthermore, Asia Pacific is expected to grow fastest over the forecast period, owing to factors such as increased focus on technological upgradations and growing demand for smart devices in the region. The growing demand for smart devices has driven investments in improved wireless and broadband networks, ensuring that these devices can function seamlessly and efficiently.

The global 3D IC Market is highly competitive owing to the presence of several key manufacturers such as Advanced Semiconductor Engineering, Inc, Amkor Technology, Inc, Samsung Electronics Co., Ltd., United Microelectronics Corporation, STMicroelectronics N.V., and others.

For further analysis on this or to request a sample copy of this report, please click the link mentioned below:

Global 3D IC Market Size study & Forecast, by Type (Stacked 3D, Monolithic 3D), by Component (Through-Silicon Via (TSV), Through Glass Via (TGV), Silicon Interposer), by Application (Logic, Imaging & optoelectronics, Memory, MEMS/Sensors, LED, Others), by End User (Consumer Electronics, Telecommunication, Automotive, Others) and Regional Analysis, 2023-2030

Key findings of the study suggest:

  • Global 3D IC Market is anticipated to grow with a healthy growth rate of more than 20% over the forecast period 2023-2030.
  • In the Type segment, stacked 3D emerged as the leading market segment in 2022.
  • North America is anticipated to drive regional growth owing to increased demand for integrated circuits.
  • Asia Pacific is expected to grow at a high CAGR followed by North America during 2023-2030.

Bizwit Research & Consulting has considered the following segments for the study:

By Type

  • Stacked 3D
  • Monolithic 3D

By Component

  • Through-Silicon Via (TSV)
  • Through Glass Via (TGV)
  • Silicon Interposer

By Application

  • Logic
  • Imaging & optoelectronics
  • Memory
  • MEMS/Sensors
  • LED
  • Others

By End User

  • Consumer Electronics
  • Telecommunication
  • Automotive
  • Military & Aerospace
  • Medical Devices
  • Industrial
  • Others

Regional Outlook

  • North America
    • US
    • Canada
  • Europe
    • UK
    • Germany
    • France
    • Spain
    • Italy
    • ROE
  • Asia Pacific
    • China
    • India
    • Japan
    • Korea
    • Australia
    • RoAPAC
  • Latin America
    • Brazil
    • Mexico
    • Rest of Latin America
  • Middle East & Africa
    • Saudi Arabia
    • South Africa
    • Rest of Middle East & Africa

To get a sample of this report or to purchase a copy of the study, you can directly contact us at: sales@bizwitresearch.com

About Us

Bizwit Research & Consulting LLP is a global provider of business intelligence & consulting services. The company has a strong primary base of key industry leaders along with the chain of industry analysts to analyze the market trends and its future impact in order to estimates and forecast different business segments and markets. Bizwit incorporate big data, expert analysis, and huge industry database to deliver client focused business consulting reports. Our analysts perform unbiased measurement and assessment of market opportunities to comprehend detailed market forecast. Our team of key opinion leaders evaluates the market size, growth prospects, end-use, applications, value & supply chain and top vendors in the industry to help the clients to take conversant business decisions without any vague assumptions.

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