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Bizwit Research & Consulting LLP is a global provider of business intelligence & consulting services. We have a strong primary base of key industry leaders along with the chain of industry analysts to analyze the market trends and its future impact in order to estimates and forecast different business segments and markets. 

Global 3D IC Market to reach USD 51.81 billion by the end of 2030.

Global 3D IC Market Size study & Forecast, by Type (Stacked 3D, Monolithic 3D), by Component (Through-Silicon Via (TSV), Through Glass Via (TGV), Silicon Interposer), by Application (Logic, Imaging & optoelectronics, Memory, MEMS/Sensors, LED, Others), by End User (Consumer Electronics, Telecommunication, Automotive, Others) and Regional Analysis, 2023-2030

Product Code: ICTH-19766020
Publish Date: 20-12-2023
Page: 200

Global 3D IC Market is valued at approximately USD 12.05 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 20% over the forecast period 2023-2030. 3D IC, or 3D Integrated Circuit, refers to a technology in which multiple semiconductor chips, also known as Integrated Circuits (ICs), are stacked vertically on top of each other to create a three-dimensional structure. This technology is employed in the field of microelectronics and integrated circuit design to overcome some of the limitations of traditional 2D integrated circuits. The 3D IC Market is expanding because of factors such as increasing demand for consumer electronics and growing demand for connected wearable devices. As a result, the demand for 3D IC has progressively increased in the international market during the forecast period 2023-2030.

Consumer electronics, such as smartphones, tablets, and gaming consoles, are continuously striving for improved performance. 3D IC technology allows for faster data transfer, reduced signal delays, and better power efficiency. As consumers demand faster, more powerful, and more energy-efficient devices, manufacturers turn to 3D ICs to meet these requirements. According to Statista, in 2023, the Consumer Electronics market is expected to be worth USD 602.50 billion and estimated to reach up to USD 950.30 billion by 2027 in between 2023-2027 at a rate of 12.07%. Furthermore, in 2023, consumer electronics retail sales in the United States account for USD 485 billion. Another important factor that drives the 3D IC Market is the increasing demand for connected wearable devices. Wearable devices are becoming more sophisticated and capable of performing complex tasks, such as health monitoring, fitness tracking, navigation, and communication. The demand for increased processing power in wearables is met by 3D ICs, which provide a way to integrate powerful processors and memory in a small space. In addition, as per Statista, in 2022, the global number of connected wearable devices increased substantially and reached up to 1.1 billion in number as compared to 929 million a year before. Moreover, the rising integration of 3D IC in smart home appliances and the growing adoption of IoT technology is anticipated to create lucrative growth opportunities for the market over the forecast period. However, high costs associated with 3D IC technology and technical complexity are going to impede overall market growth throughout the forecast period of 2023-2030.

The key regions considered for the Global 3D IC Market study includes Asia Pacific, North America, Europe, Latin America, and Middle East & Africa. North America dominated the market in 2022 owing to the increased demand for integrated circuits due to technological advancements in the region. The region’s dominant performance is anticipated to propel the overall demand for 3D IC. Furthermore, Asia Pacific is expected to grow fastest over the forecast period, owing to factors such as increased focus on technological upgradations and growing demand for smart devices in the region. The growing demand for smart devices has driven investments in improved wireless and broadband networks, ensuring that these devices can function seamlessly and efficiently.

Major market player included in this report are:
Advanced Semiconductor Engineering, Inc
Amkor Technology, Inc
Samsung Electronics Co., Ltd.
United Microelectronics Corporation
STMicroelectronics N.V.
Toshiba Corporation
Intel Corporation
Micron Technology, Inc
Taiwan Semiconductor Manufacturing Company Limited
Xilinx Inc

Recent Developments in the Market:
Ø In October 2023, During the TSMC 2023 OIP Ecosystem Forum, Taiwan Semiconductor Manufacturing Co. Ltd unveiled the new 3Dblox 2.0 open standard and highlighted important achievements within its Open Innovation Platform (OIP) 3DFabric Alliance. 3Dblox 2.0 features sophisticated 3D IC design tools that are intended to considerably improve design efficiency. Simultaneously, the 3DFabric Alliance continues to promote integration across memory, substrate, testing, manufacturing, and packaging. TSMC stays at the forefront of 3D IC innovation, bringing its vast 3D silicon stacking and superior packaging capabilities to a wider variety of customers.

Global 3D IC Market Report Scope:
ü Historical Data – 2020 – 2021
ü Base Year for Estimation – 2022
ü Forecast period – 2023-2030
ü Report Coverage – Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
ü Segments Covered – Type, Component, Application, End User, Region
ü Regional Scope – North America; Europe; Asia Pacific; Latin America; Middle East & Africa
ü Customization Scope – Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Type
Stacked 3D
Monolithic 3D

By Component
Through-Silicon Via (TSV)
Through Glass Via (TGV)
Silicon Interposer

By Application
Logic
Imaging & optoelectronics
Memory
MEMS/Sensors
LED
Others

By End User
Consumer Electronics
Telecommunication
Automotive
Military & Aerospace
Medical Devices
Industrial
Others

By Region:

North America
U.S.
Canada

Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC

Latin America
Brazil
Mexico

Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2020-2030 (USD Billion)
1.2.1. 3D IC Market, by Region, 2020-2030 (USD Billion)
1.2.2. 3D IC Market, by Type, 2020-2030 (USD Billion)
1.2.3. 3D IC Market, by Component, 2020-2030 (USD Billion)
1.2.4. 3D IC Market, by Application, 2020-2030 (USD Billion)
1.2.5. 3D IC Market, by End User, 2020-2030 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global 3D IC Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Industry Evolution
2.2.2. Scope of the Study
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global 3D IC Market Dynamics
3.1. 3D IC Market Impact Analysis (2020-2030)
3.1.1. Market Drivers
3.1.1.1. Increasing demand for consumer electronics
3.1.1.2. Growing demand for connected wearable devices
3.1.2. Market Challenges
3.1.2.1. High costs associated with 3D IC technology
3.1.2.2. Technical complexity
3.1.3. Market Opportunities
3.1.3.1. Rising integration of 3D IC in smart home appliances
3.1.3.2. Growing adoption of IoT technology
Chapter 4. Global 3D IC Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.2. Porter’s 5 Force Impact Analysis
4.3. PEST Analysis
4.3.1. Political
4.3.2. Economical
4.3.3. Social
4.3.4. Technological
4.3.5. Environmental
4.3.6. Legal
4.4. Top investment opportunity
4.5. Top winning strategies
4.6. COVID-19 Impact Analysis
4.7. Disruptive Trends
4.8. Industry Expert Perspective
4.9. Analyst Recommendation & Conclusion
Chapter 5. Global 3D IC Market, by Type
5.1. Market Snapshot
5.2. Global 3D IC Market by Type, Performance – Potential Analysis
5.3. Global 3D IC Market Estimates & Forecasts by Type 2020-2030 (USD Billion)
5.4. 3D IC Market, Sub Segment Analysis
5.4.1. Stacked 3D
5.4.2. Monolithic 3D
Chapter 6. Global 3D IC Market, by Component
6.1. Market Snapshot
6.2. Global 3D IC Market by Component, Performance – Potential Analysis
6.3. Global 3D IC Market Estimates & Forecasts by Component 2020-2030 (USD Billion)
6.4. 3D IC Market, Sub Segment Analysis
6.4.1. Through-Silicon Via (TSV)
6.4.2. Through Glass Via (TGV)
6.4.3. Silicon Interposer
Chapter 7. Global 3D IC Market, by Application
7.1. Market Snapshot
7.2. Global 3D IC Market by Application, Performance – Potential Analysis
7.3. Global 3D IC Market Estimates & Forecasts by Application 2020-2030 (USD Billion)
7.4. 3D IC Market, Sub Segment Analysis
7.4.1. Logic
7.4.2. Imaging & optoelectronics
7.4.3. Memory
7.4.4. MEMS/Sensors
7.4.5. LED
7.4.6. Others
Chapter 8. Global 3D IC Market, by End User
8.1. Market Snapshot
8.2. Global 3D IC Market by End User, Performance – Potential Analysis
8.3. Global 3D IC Market Estimates & Forecasts by End User 2020-2030 (USD Billion)
8.4. 3D IC Market, Sub Segment Analysis
8.4.1. Consumer Electronics
8.4.2. Telecommunication
8.4.3. Automotive
8.4.4. Military & Aerospace
8.4.5. Medical Devices
8.4.6. Industrial
8.4.7. Others
Chapter 9. Global 3D IC Market, Regional Analysis
9.1. Top Leading Countries
9.2. Top Emerging Countries
9.3. 3D IC Market, Regional Market Snapshot
9.4. North America 3D IC Market
9.4.1. U.S. 3D IC Market
9.4.1.1. Type breakdown estimates & forecasts, 2020-2030
9.4.1.2. Component breakdown estimates & forecasts, 2020-2030
9.4.1.3. Application breakdown estimates & forecasts, 2020-2030
9.4.1.4. End User breakdown estimates & forecasts, 2020-2030
9.4.2. Canada 3D IC Market
9.5. Europe 3D IC Market Snapshot
9.5.1. U.K. 3D IC Market
9.5.2. Germany 3D IC Market
9.5.3. France 3D IC Market
9.5.4. Spain 3D IC Market
9.5.5. Italy 3D IC Market
9.5.6. Rest of Europe 3D IC Market
9.6. Asia-Pacific 3D IC Market Snapshot
9.6.1. China 3D IC Market
9.6.2. India 3D IC Market
9.6.3. Japan 3D IC Market
9.6.4. Australia 3D IC Market
9.6.5. South Korea 3D IC Market
9.6.6. Rest of Asia Pacific 3D IC Market
9.7. Latin America 3D IC Market Snapshot
9.7.1. Brazil 3D IC Market
9.7.2. Mexico 3D IC Market
9.8. Middle East & Africa 3D IC Market
9.8.1. Saudi Arabia 3D IC Market
9.8.2. South Africa 3D IC Market
9.8.3. Rest of Middle East & Africa 3D IC Market

Chapter 10. Competitive Intelligence
10.1. Key Company SWOT Analysis
10.1.1. Company 1
10.1.2. Company 2
10.1.3. Company 3
10.2. Top Market Strategies
10.3. Company Profiles
10.3.1. Advanced Semiconductor Engineering, Inc
10.3.1.1. Key Information
10.3.1.2. Overview
10.3.1.3. Financial (Subject to Data Availability)
10.3.1.4. Product Summary
10.3.1.5. Recent Developments
10.3.2. Amkor Technology, Inc
10.3.3. Samsung Electronics Co., Ltd.
10.3.4. United Microelectronics Corporation
10.3.5. STMicroelectronics N.V.
10.3.6. Toshiba Corporation
10.3.7. Intel Corporation
10.3.8. Micron Technology, Inc
10.3.9. Taiwan Semiconductor Manufacturing Company Limited
10.3.10. Xilinx Inc
Chapter 11. Research Process
11.1. Research Process
11.1.1. Data Mining
11.1.2. Analysis
11.1.3. Market Estimation
11.1.4. Validation
11.1.5. Publishing
11.2. Research Attributes
11.3. Research Assumption

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Market driving trends and favorable economic conditions
Restraints and challenges that are expected to be encountered during the forecast period.
Anticipated opportunities for growth and development
Technological advancements and projected developments in the market
Consumer spending trends and dynamics
Shifts in consumer preferences and behaviors.
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Regulatory landscape and expected changes or developments.
The existing capacity in the market and any expected additions or expansions up to the end of the forecast period.
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