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Global Semiconductor Bonding Market to reach USD 1101.18 million by 2027.

Global Semiconductor Bonding Market Size study, by Process type(Die-to-die bonding, Die-to-wafer bonding, Wafer-to-wafer bonding), by Technology (die bonding, wafer bonding), by type (Die bonder, wafer bonder, flip chip bonder) by Application (Mems and sensors, Cmos image sensors (cis), Radiofrequency (rf) devices, LED), and Regional Forecasts 2021-2027

Product Code: EESC-41572505
Publish Date: 10-09-2021
Page: 200

Global Semiconductor Bonding Market is valued approximately at USD 848.16 Million in 2020 and is anticipated to grow with a healthy growth rate of more than 3.8% over the forecast period 2021-2027. The global Semiconductor Bonding market is being driven by growing adoption of stacked die technology in IoT devices and rising demand for electric and hybrid vehicles in various regions. Furthermore, increasing demand for 3D semiconductor assembly and packaging as well as growing adoption of IoT and AI in automotive sector will provide new opportunities for the global Semiconductor Bonding industry. For instance, according to statista, there has been significant rise in the production of hybrid electric vehicles; in year 2020, the production stood at 2.9 million units worldwide, and it is expected to grow to 5.4 million units by year 2025. As a result, increased production of hybrid electric vehicles will necessitate the use of semiconductor bonding and will serve as a catalyst for the Semiconductor Bonding industry in the future. However, high cost of ownership may impede market growth over the forecast period of 2021-2027.

Asia Pacific, North America, Europe, Latin America, and Rest of the World are the key region considered for the regional analysis of global Semiconductor Bonding Market. The increasing number of IDMs in the region makes Asia Pacific a significant region across the world in terms of market share. Whereas Asia pacific is also anticipated to exhibit the highest CAGR over the forecast period 2021-2027, due to the mass production of electronic products such as smartphones, wearables, and white goods in China and Taiwan in the region.
Major market player included in this report are:

Asm pacific technology
Fasford technology
Shinkawa LTD
EV group (EVG)
Suss microtec SE
Kulicke & soffa industries
Palomar technologies
Shibaura mechatronics

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Process Type:
Die-to-die bonding
Die-to-wafer bonding
Wafer-to-wafer bonding
By Technology:
Die bonding
wafer bonding
By type:
Die bonder
Wafer bonder
Flip chip Bonder
By Application:
Mems and sensors
Cmos image sensors (cis)
Radiofrequency (rf) devices

By Region:
North America

Asia Pacific
South Korea
Latin America
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2018, 2019
Base year – 2020
Forecast period – 2021 to 2027.

Target Audience of the Global Semiconductor Bonding Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2027 (USD Million)
1.2.1. Semiconductor Bonding Market, by region, 2019-2027 (USD Million)
1.2.2. Semiconductor Bonding Market, by Process Type, 2019-2027 (USD Million)
1.2.3. Semiconductor Bonding Market, by Technology, 2019-2027 (USD Million)
1.2.4. Semiconductor Bonding Market, by Type, 2019-2027 (USD Million)
1.2.5. Semiconductor Bonding Market, by Application, 2019-2027 (USD Million)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Semiconductor Bonding Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Semiconductor Bonding Market Dynamics
3.1. Semiconductor Bonding Market Impact Analysis (2019-2027)
3.1.1. Market Drivers Increasing adoption of stacked die technology in IoT devices Rising demand for electric and hybrid vehicles
3.1.2. Market Restraint High cost of ownership
3.1.3. Market Opportunities Increasing demand for 3D semiconductor assembly and packaging Growing adoption of IoT and AI in automotive sector
Chapter 4. Global Semiconductor Bonding Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.1.6. Futuristic Approach to Porter’s 5 Force Model (2018-2027)
4.2. PEST Analysis
4.2.1. Political
4.2.2. Economical
4.2.3. Social
4.2.4. Technological
4.3. Investment Adoption Model
4.4. Analyst Recommendation & Conclusion
Chapter 5. Global Semiconductor Bonding Market, by Process Type
5.1. Market Snapshot
5.2. Global Semiconductor Bonding Market by Process Type, Performance – Potential Analysis
5.3. Global Semiconductor Bonding Market Estimates & Forecasts by Process Type 2018-2027 (USD Million)
5.4. Semiconductor Bonding Market, Sub Segment Analysis
5.4.1. Die-to-die bonding
5.4.2. Die-to-wafer bonding
5.4.3. Wafer-to-wafer bonding
Chapter 6. Global Semiconductor Bonding Market, by Technology
a. Market Snapshot
6.1. Global Semiconductor Bonding Market by Technology, Performance – Potential Analysis
6.2. Global Semiconductor Bonding Market Estimates & Forecasts by Technology 2018-2027 (USD Million)
6.3. Semiconductor Bonding Market, Sub Segment Analysis
6.3.1. Die bonding
6.3.2. Wafer bonding
Chapter 7. Global Semiconductor Bonding Market, by Type
b. Market Snapshot
7.1. Global Semiconductor Bonding Market by Type, Performance – Potential Analysis
7.2. Global Semiconductor Bonding Market Estimates & Forecasts by Type 2018-2027 (USD Million)
7.3. Semiconductor Bonding Market, Sub Segment Analysis
7.3.1. Die bonder
7.3.2. Wafer bonder
7.3.3. Flip chip Bonder

Chapter 8. Global Semiconductor Bonding Market, by Application
c. Market Snapshot
8.1. Global Semiconductor Bonding Market by Application, Performance – Potential Analysis
8.2. Global Semiconductor Bonding Market Estimates & Forecasts by Application 2018-2027 (USD Million)
8.3. Semiconductor Bonding Market, Sub Segment Analysis
8.3.1. Mems and sensors
8.3.2. Cmos image sensors (cis)
8.3.3. Radiofrequency (rf) devices
8.3.4. LED
8.3.5. 3D Nand
Chapter 9. Global Semiconductor Bonding Market, Regional Analysis
9.1. Semiconductor Bonding Market, Regional Market Snapshot
9.2. North America Semiconductor Bonding Market
9.2.1. U.S. Semiconductor Bonding Market Process Type breakdown estimates & forecasts, 2018-2027 Technology breakdown estimates & forecasts, 2018-2027 Type breakdown estimated & forecasts, 2018-2027 Application breakdown estimates & forecasts, 2018-2027
9.2.2. Canada Semiconductor Bonding Market
9.3. Europe Semiconductor Bonding Market Snapshot
9.3.1. U.K. Semiconductor Bonding Market
9.3.2. Germany Semiconductor Bonding Market
9.3.3. France Semiconductor Bonding Market
9.3.4. Spain Semiconductor Bonding Market
9.3.5. Italy Semiconductor Bonding Market
9.3.6. Rest of Europe Semiconductor Bonding Market
9.4. Asia-Pacific Semiconductor Bonding Market Snapshot
9.4.1. China Semiconductor Bonding Market
9.4.2. India Semiconductor Bonding Market
9.4.3. Japan Semiconductor Bonding Market
9.4.4. Australia Semiconductor Bonding Market
9.4.5. South Korea Semiconductor Bonding Market
9.4.6. Rest of Asia Pacific Semiconductor Bonding Market
9.5. Latin America Semiconductor Bonding Market Snapshot
9.5.1. Brazil Semiconductor Bonding Market
9.5.2. Mexico Semiconductor Bonding Market
9.6. Rest of The World Semiconductor Bonding Market
Chapter 10. Competitive Intelligence
10.1. Top Market Strategies
10.2. Company Profiles
10.2.1. Asm pacific technology Key Information Overview Financial (Subject to Data Availability) Product Summary Recent Developments
10.2.2. BESI
10.2.3. Panasonic
10.2.4. Fasford technology
10.2.5. Shinkawa LTD
10.2.6. EV group (EVG)
10.2.7. Suss microtec SE
10.2.8. Kulicke & soffa industries
10.2.9. Palomar technologies
10.2.10. Shibaura mechatronics

Chapter 11. Research Process
11.1. Research Process
11.1.1. Data Mining
11.1.2. Analysis
11.1.3. Market Estimation
11.1.4. Validation
11.1.5. Publishing
11.2. Research Attributes
11.3. Research Assumption

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Critical elements of methodology employed for all our studies include:
Data Collection:
To determine the appropriate methods of data collection based on the research objectives, we consider both primary and secondary sources. Primary data collection involves gathering information directly from various industry experts in core and related fields, original equipment manufacturers (OEMs), vendors, suppliers, technology developers, alliances, and organizations. These sources encompass all segments of the value chain within the specific industry. Through in-depth interviews, we engage with key industry participants, subject-matter experts, C-level executives of major market players, industry consultants, and other relevant experts. This allows us to obtain and validate critical qualitative and quantitative information while evaluating market prospects. AI and Big Data are instrumental in our primary research, providing us with powerful tools to collect, analyze, and derive insights from data efficiently. These technologies contribute to the advancement of research methodologies, enabling us to make data-driven decisions and uncover valuable findings.
In addition to primary sources, we extensively utilize secondary sources to enhance our research. These include directories, databases, journals focusing on related industries, company newsletters, and information portals such as Bloomberg, D&B Hoovers, and Factiva. These secondary sources enable us to identify and gather valuable information for our comprehensive, technical, market-oriented, and commercial study of the market. Additionally, we utilize AI algorithms to automate the collection of vast amounts of data from various sources such as surveys, social media platforms, online transactions, and web scraping. And employ Big Data technologies for storage and processing of large datasets, ensuring that no valuable information is missed during the data collection process.
Data Analysis:
Our team of experts carefully examine the gathered data using suitable statistical techniques and qualitative analysis methods. For quantitative analysis, we employ descriptive statistics, regression analysis, and other advanced statistical methods, depending on the characteristics of the data. This analysis may also incorporate the utilization of AI tools and big data analysis techniques to extract meaningful insights.
To ensure the accuracy and reliability of our findings, we extensively leverage data science techniques, which help us minimize discrepancies and uncertainties in our analysis. We employ Data Science to clean and preprocess the data, ensuring its quality and reliability. This involves handling missing data, removing outliers, standardizing variables, and transforming data into suitable formats for analysis. The application of data science techniques enhances our accuracy, efficiency, and depth of analysis, enabling us to stay competitive in dynamic market environments.
Market Size Estimation:
Our proprietary data tools play a crucial role in deriving our market estimates and forecasts. Each study involves the creation of a unique and customized model. The model incorporates the gathered information on market dynamics, technology landscape, application development, and pricing trends. AI techniques, such as machine learning and deep learning, aid us to analyze patterns within the data to identify correlations, trends, and relationships. By recognizing patterns in consumer behavior, purchasing habits, or market dynamics, our AI algorithms aid us in more precise estimations of market size. These factors are simultaneously analyzed within the model, allowing for a comprehensive assessment. To quantify their impact over the forecast period, correlation, regression, and time series analysis are employed.
To estimate and validate the market size, we employ both top-down and bottom-up approaches. The preference is given to a bottom-up approach, where key regional markets are analyzed as separate entities. This data is then integrated to obtain global estimates. This approach is crucial as it provides a deep understanding of the industry and helps minimize errors.
In our forecasting process, we consider various parameters such as economic tools, technological analysis, industry experience, and domain expertise. By taking all these factors into account, we strive to produce accurate and reliable market forecasts. When forecasting, we take into consideration several parameters, which include:
Market driving trends and favorable economic conditions
Restraints and challenges that are expected to be encountered during the forecast period.
Anticipated opportunities for growth and development
Technological advancements and projected developments in the market
Consumer spending trends and dynamics
Shifts in consumer preferences and behaviors.
The current state of raw materials and trends in supply versus pricing
Regulatory landscape and expected changes or developments.
The existing capacity in the market and any expected additions or expansions up to the end of the forecast period.
To assess the market impact of these parameters, we assign weights to each one and utilize weighted average analysis. This process allows us to quantify their influence on the market and derive an expected growth rate for the forecasted period. By considering these various factors and applying a weighted analysis approach, we strive to provide accurate and reliable market forecasts.
Insight Generation & Report Presentation:
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Next, we create a well-structured research report that effectively communicates the research findings, insights, and recommendations to the client. To enhance clarity and comprehension, we utilize visual aids such as charts, graphs, and tables. These visual elements are employed to present the data in an engaging and easily understandable format, ensuring that the information is accessible and visually appealing to the client. Our aim is to deliver a clear and concise report that conveys the research findings effectively and provides actionable recommendations to meet the client’s specific needs.

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