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Global Power Module Packaging Market to reach USD XX billion by the end of 2029.

Global Power Module Packaging Market Size study & Forecast, by Component (Substrate, Baseplate, Die Attach and Substrate Attach, Encapsulations, and Interconnections) and Regional Analysis, 2022-2029

Product Code: CMP-54502951
Publish Date: 15-05-2023
Page: 200

The global Power Module Packaging Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. A power electronic module, also known as a power module, serves as a physical container for storing several power components, most commonly power semiconductor devices.
The Power Module Packaging market is expanding because of factors such as the rising demand for the consumer electronics segment and growing demand from the industrial segment in the forecast period

According to Indian Brand Equity Foundation in 2021, the production of consumer electronics is rising from USD 29 billion to USD 67 billion during 2015-2021. It includes IT hardware & components, smartphones, semiconductor and design, and so on. Whereas rising government focus on renewable energy and technological advancement and innovations create lucrative opportunities for the market. Furthermore, Global renewable energy generating capacity was 2,351 GW in 2018, according to the International Renewable Energy Agency. When compared to the previous year, it showed an increase of 7.9%. The capacity of wind and solar energy were 564 GW and 486 GW, respectively. However, slow adoption of new technologies derailing innovations hampers the market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Power Module Packaging Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. Asia Pacific dominated the market in terms of revenue, owing to the increasing industrialization and growing urbanization. Whereas the Asia Pacific is expected to grow with the highest CAGR during the forecast period, owing to factors such as increasing government regulations towards adoption of renewable energies, penetration of market players and growth activities.

Major market players included in this report are:
Fuji Electric Co. Ltd
Infineon Technologies AG
Mitsubishi Electric Corporation (Powerex Inc.)
Semikron
Amkor Technology Inc.
Hitachi Ltd
STMicroelectronics NV

Recent Developments in the Market:
Ø In February 2019, Infineon Technologies Ag expanded its CoolSiCTM power module portfolio for UPS and energy storage applications. The CoolSiC 2B power modules, according to Infineon, allow engineers to reduce total system costs by increasing power density. When compared to silicon variants, the product has 80% lower switching losses, allowing inverter efficiency levels to exceed 99%.

Global Power Module Packaging Market Report Scope:
Historical Data 2019-2020-2021
Base Year for Estimation 2021
Forecast period 2022-2029
Report Coverage Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered Component, Region
Regional Scope North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Component:
Substrate,
Baseplate,
Die Attach and Substrate Attach,
Encapsulations,
Interconnections

By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
RoLA
Rest of the World

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2029 (USD Billion)
1.2.1. Power Module Packaging Market, by Region, 2019-2029 (USD Billion)
1.2.2. Power Module Packaging Market, by Component, 2019-2029 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Power Module Packaging Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Power Module Packaging Market Dynamics
3.1. Power Module Packaging Market Impact Analysis (2019-2029)
3.1.1. Market Drivers
3.1.1.1. Rising demand for consumer electronics segment
3.1.1.2. Growing demand from the industrial segment
3.1.2. Market Challenges
3.1.2.1. Slow Adoption of New Technologies Derailing Innovation
3.1.3. Market Opportunities
3.1.3.1. Rising government focus towards renewable energy
3.1.3.2. Technological advancement and innovations
Chapter 4. Global Power Module Packaging Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.2. Futuristic Approach to Porter’s 5 Force Model (2019-2029)
4.3. PEST Analysis
4.3.1. Political
4.3.2. Economical
4.3.3. Social
4.3.4. Technological
4.4. Top investment opportunity
4.5. Top winning strategies
4.6. Industry Experts Prospective
4.7. Analyst Recommendation & Conclusion
Chapter 5. Risk Assessment: COVID-19 Impact
5.1. Assessment of the overall impact of COVID-19 on the industry
5.2. Pre COVID-19 and post COVID-19 Market scenario
Chapter 6. Global Power Module Packaging Market, by Component
6.1. Market Snapshot
6.2. Global Power Module Packaging Market by Component, Performance – Potential Analysis
6.3. Global Power Module Packaging Market Estimates & Forecasts by Component, 2019-2029 (USD Billion)
6.4. Power Module Packaging Market, Sub Segment Analysis
6.4.1. Substrate
6.4.2. Baseplate
6.4.3. Die Attach and Substrate Attach
6.4.4. Encapsulations
6.4.5. Interconnections
Chapter 7. Global Power Module Packaging Market, Regional Analysis
7.1. Power Module Packaging Market, Regional Market Snapshot
7.2. North America Power Module Packaging Market
7.2.1. U.S. Power Module Packaging Market
7.2.1.1. Component breakdown estimates & forecasts, 2019-2029
7.2.2. Canada Power Module Packaging Market
7.3. Europe Power Module Packaging Market Snapshot
7.3.1. U.K. Power Module Packaging Market
7.3.2. Germany Power Module Packaging Market
7.3.3. France Power Module Packaging Market
7.3.4. Spain Power Module Packaging Market
7.3.5. Italy Power Module Packaging Market
7.3.6. Rest of Europe Power Module Packaging Market
7.4. Asia-Pacific Power Module Packaging Market Snapshot
7.4.1. China Power Module Packaging Market
7.4.2. India Power Module Packaging Market
7.4.3. Japan Power Module Packaging Market
7.4.4. Australia Power Module Packaging Market
7.4.5. South Korea Power Module Packaging Market
7.4.6. Rest of Asia Pacific Power Module Packaging Market
7.5. Latin America Power Module Packaging Market Snapshot
7.5.1. Brazil Power Module Packaging Market
7.5.2. Mexico Power Module Packaging Market
7.5.3. Rest of Latin America Power Module Packaging Market
7.6. Rest of The World Power Module Packaging Market

Chapter 8. Competitive Intelligence
8.1. Top Market Strategies
8.2. Company Profiles
8.2.1. Fuji Electric Co. Ltd
8.2.1.1. Key Information
8.2.1.2. Overview
8.2.1.3. Financial (Subject to Data Availability)
8.2.1.4. Product Summary
8.2.1.5. Recent Developments
8.2.2. Infineon Technologies AG
8.2.3. Mitsubishi Electric Corporation (Powerex Inc.)
8.2.4. Semikron
8.2.5. Amkor Technology Inc.
8.2.6. Hitachi Ltd
8.2.7. STMicroelectronics NV
Chapter 9. Research Process
9.1. Research Process
9.1.1. Data Mining
9.1.2. Analysis
9.1.3. Market Estimation
9.1.4. Validation
9.1.5. Publishing
9.2. Research Attributes
9.3. Research Assumption

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Data Collection:
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To ensure the accuracy and reliability of our findings, we extensively leverage data science techniques, which help us minimize discrepancies and uncertainties in our analysis. We employ Data Science to clean and preprocess the data, ensuring its quality and reliability. This involves handling missing data, removing outliers, standardizing variables, and transforming data into suitable formats for analysis. The application of data science techniques enhances our accuracy, efficiency, and depth of analysis, enabling us to stay competitive in dynamic market environments.
Market Size Estimation:
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To estimate and validate the market size, we employ both top-down and bottom-up approaches. The preference is given to a bottom-up approach, where key regional markets are analyzed as separate entities. This data is then integrated to obtain global estimates. This approach is crucial as it provides a deep understanding of the industry and helps minimize errors.
In our forecasting process, we consider various parameters such as economic tools, technological analysis, industry experience, and domain expertise. By taking all these factors into account, we strive to produce accurate and reliable market forecasts. When forecasting, we take into consideration several parameters, which include:
Market driving trends and favorable economic conditions
Restraints and challenges that are expected to be encountered during the forecast period.
Anticipated opportunities for growth and development
Technological advancements and projected developments in the market
Consumer spending trends and dynamics
Shifts in consumer preferences and behaviors.
The current state of raw materials and trends in supply versus pricing
Regulatory landscape and expected changes or developments.
The existing capacity in the market and any expected additions or expansions up to the end of the forecast period.
To assess the market impact of these parameters, we assign weights to each one and utilize weighted average analysis. This process allows us to quantify their influence on the market and derive an expected growth rate for the forecasted period. By considering these various factors and applying a weighted analysis approach, we strive to provide accurate and reliable market forecasts.
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