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Global Passive and Interconnecting Electronic Components Market to reach USD XX million by 2028.

Global Passive and Interconnecting Electronic Components Market Size study, By Component Type (Passive, Interconnecting), By Application (Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Aerospace & Defense, Healthcare, Others), and Regional Forecasts 2022-2028

Product Code: EESC-51111174
Publish Date: 13-06-2022
Page: 200

Global Passive and Interconnecting Electronic Components Market is valued approximately USD XX million in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2028. Passive Electronic Components can be defined as an electrical component that does not generate power, but instead dissipates, stores, and releases it. Passive elements include resistances, capacitors, and coils. Whereas, interconnects are structures that connect two or more circuit elements (such as transistors) together. The growing penetration of smartphones and laptops and increasing adoption of internet of things (IoT) devices as well as recent acquisition activities are factors that are accelerating the global market demand. For instance, according to Statista – In 2021, number of smartphone users globally were estimated at 6259 million, and this number is projected to grow to 7690 million by end of 2027. Furthermore, as per India Brand Equity Forum (IBEF) – In 2019, around 302 million smartphones were manufactured in India, and this number is projected to grow to 829 million by end of 2022. Moreover, in March 2022, US based KYOCERA AVX, announced acquisition of Kyoto, Japan based ROHM Semiconductor’s tantalum and polymer capacitor business assets. This acquisition would help the company in strengthening its portfolio of electrolytic capacitor solutions. Also, growing investment towards 5G network infrastructure and rising automation across different industries are anticipated to act as a catalyzing factor for the market demand during the forecast period. However, volatile cost of raw materials impedes the growth of the market over the forecast period of 2022-2028.

The key regions considered for the global Passive and Interconnecting Electronic Components Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. North America is the leading region across the world in terms of market share owing to the growing investment towards 5G network infrastructure and recent acquisition activities in the region. Whereas, Asia Pacific is anticipated to exhibit a significant growth rate over the forecast period 2022-2028. Factors such as growing penetration of electric and electronics devices and rising deployment of 5G network solutions in the region, would create lucrative growth prospects for the global Passive and Interconnecting Electronic Components Market across the Asia Pacific region.

Major market players included in this report are:
AVX Corporation

Vishay Intertechnology, Inc.

Mouser Electronics, Inc.

Murata Manufacturing Co., Ltd.

TDK Corporation

Taiyo Yuden Co., Ltd.

Samsung Electro-Mechanics

Hosiden Corporation

Yageo Corporation

Nichicon Corporation

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Component Type
Passive
Interconnecting

By Application
Consumer Electronics
IT & Telecommunication
Automotive
Industrial
Aerospace & Defense
Healthcare
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2018, 2019, 2020
Base year – 2021
Forecast period – 2022 to 2028

Target Audience of the Global Passive and Interconnecting Electronic Components Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2020-2028 (USD Million)
1.2.1. Global Passive and Interconnecting Electronic Components Market, by Region, 2020-2028 (USD Million)
1.2.2. Global Passive and Interconnecting Electronic Components Market, by Component Type, 2020-2028 (USD Million)
1.2.3. Global Passive and Interconnecting Electronic Components Market, by Application, 2020-2028 (USD Million)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Passive and Interconnecting Electronic Components Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Passive and Interconnecting Electronic Components Market Dynamics
3.1. Passive and Interconnecting Electronic Components Market Impact Analysis (2020-2028)
3.1.1. Market Drivers
3.1.1.1. Growing penetration of smartphones and laptops.
3.1.1.2. Increasing adoption of internet of things (IoT) devices.
3.1.1.3. Recent acquisition activities.
3.1.2. Market Challenges
3.1.2.1. Volatile cost of raw materials.
3.1.3. Market Opportunities
3.1.3.1. Growing investment towards 5G network infrastructure.
3.1.3.2. Rising automation across different industries.
Chapter 4. Global Passive and Interconnecting Electronic Components Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.1.6. Futuristic Approach to Porter’s 5 Force Model (2018-2028)
4.2. PEST Analysis
4.2.1. Political
4.2.2. Economical
4.2.3. Social
4.2.4. Technological
4.3. Investment Adoption Model
4.4. Analyst Recommendation & Conclusion
4.5. Top investment opportunity
4.6. Top winning strategies
Chapter 5. Risk Assessment: COVID-19 Impact
5.1.1. Assessment of the overall impact of COVID-19 on the industry
5.1.2. Pre COVID-19 and post COVID-19 Market scenario
Chapter 6. Global Passive and Interconnecting Electronic Components Market, by Component Type
6.1. Market Snapshot
6.2. Global Passive and Interconnecting Electronic Components Market by Component Type, Performance – Potential Analysis
6.3. Global Passive and Interconnecting Electronic Components Market Estimates & Forecasts by Component Type 2018-2028 (USD Million)
6.4. Passive and Interconnecting Electronic Components Market, Sub Segment Analysis
6.4.1. Passive
6.4.2. Interconnecting
Chapter 7. Global Passive and Interconnecting Electronic Components Market, by Application
7.1. Market Snapshot
7.2. Global Passive and Interconnecting Electronic Components Market by Application, Performance – Potential Analysis
7.3. Global Passive and Interconnecting Electronic Components Market Estimates & Forecasts by Application 2018-2028 (USD Million)
7.4. Passive and Interconnecting Electronic Components Market, Sub Segment Analysis
7.4.1. Consumer Electronics
7.4.2. IT & Telecommunication
7.4.3. Automotive
7.4.4. Industrial
7.4.5. Aerospace & Defense
7.4.6. Healthcare
7.4.7. Others
Chapter 8. Global Passive and Interconnecting Electronic Components Market, Regional Analysis
8.1. Passive and Interconnecting Electronic Components Market, Regional Market Snapshot
8.2. North America Passive and Interconnecting Electronic Components Market
8.2.1. U.S. Passive and Interconnecting Electronic Components Market
8.2.1.1. Component Type estimates & forecasts, 2018-2028
8.2.1.2. Application estimates & forecasts, 2018-2028
8.2.2. Canada Passive and Interconnecting Electronic Components Market
8.3. Europe Passive and Interconnecting Electronic Components Market Snapshot
8.3.1. U.K. Passive and Interconnecting Electronic Components Market
8.3.2. Germany Passive and Interconnecting Electronic Components Market
8.3.3. France Passive and Interconnecting Electronic Components Market
8.3.4. Spain Passive and Interconnecting Electronic Components Market
8.3.5. Italy Passive and Interconnecting Electronic Components Market
8.3.6. Rest of Europe Passive and Interconnecting Electronic Components Market
8.4. Asia-Pacific Passive and Interconnecting Electronic Components Market Snapshot
8.4.1. China Passive and Interconnecting Electronic Components Market
8.4.2. India Passive and Interconnecting Electronic Components Market
8.4.3. Japan Passive and Interconnecting Electronic Components Market
8.4.4. Australia Passive and Interconnecting Electronic Components Market
8.4.5. South Korea Passive and Interconnecting Electronic Components Market
8.4.6. Rest of Asia Pacific Passive and Interconnecting Electronic Components Market
8.5. Latin America Passive and Interconnecting Electronic Components Market Snapshot
8.5.1. Brazil Passive and Interconnecting Electronic Components Market
8.5.2. Mexico Passive and Interconnecting Electronic Components Market
8.6. Rest of The World Passive and Interconnecting Electronic Components Market

Chapter 9. Competitive Intelligence
9.1. Top Market Strategies
9.2. Company Profiles
9.2.1. AVX Corporation
9.2.1.1. Key Information
9.2.1.2. Overview
9.2.1.3. Financial (Subject to Data Availability)
9.2.1.4. Product Summary
9.2.1.5. Recent Developments
9.2.2. Vishay Intertechnology, Inc.
9.2.3. Mouser Electronics, Inc.
9.2.4. Murata Manufacturing Co., Ltd.
9.2.5. TDK Corporation
9.2.6. Taiyo Yuden Co., Ltd.
9.2.7. Samsung Electro-Mechanics
9.2.8. Hosiden Corporation
9.2.9. Yageo Corporation
9.2.10. Nichicon Corporation
Chapter 10. Research Process
10.1. Research Process
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.2. Research Attributes
10.3. Research Assumption

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Data Collection:
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Our team of experts carefully examine the gathered data using suitable statistical techniques and qualitative analysis methods. For quantitative analysis, we employ descriptive statistics, regression analysis, and other advanced statistical methods, depending on the characteristics of the data. This analysis may also incorporate the utilization of AI tools and big data analysis techniques to extract meaningful insights.
To ensure the accuracy and reliability of our findings, we extensively leverage data science techniques, which help us minimize discrepancies and uncertainties in our analysis. We employ Data Science to clean and preprocess the data, ensuring its quality and reliability. This involves handling missing data, removing outliers, standardizing variables, and transforming data into suitable formats for analysis. The application of data science techniques enhances our accuracy, efficiency, and depth of analysis, enabling us to stay competitive in dynamic market environments.
Market Size Estimation:
Our proprietary data tools play a crucial role in deriving our market estimates and forecasts. Each study involves the creation of a unique and customized model. The model incorporates the gathered information on market dynamics, technology landscape, application development, and pricing trends. AI techniques, such as machine learning and deep learning, aid us to analyze patterns within the data to identify correlations, trends, and relationships. By recognizing patterns in consumer behavior, purchasing habits, or market dynamics, our AI algorithms aid us in more precise estimations of market size. These factors are simultaneously analyzed within the model, allowing for a comprehensive assessment. To quantify their impact over the forecast period, correlation, regression, and time series analysis are employed.
To estimate and validate the market size, we employ both top-down and bottom-up approaches. The preference is given to a bottom-up approach, where key regional markets are analyzed as separate entities. This data is then integrated to obtain global estimates. This approach is crucial as it provides a deep understanding of the industry and helps minimize errors.
In our forecasting process, we consider various parameters such as economic tools, technological analysis, industry experience, and domain expertise. By taking all these factors into account, we strive to produce accurate and reliable market forecasts. When forecasting, we take into consideration several parameters, which include:
Market driving trends and favorable economic conditions
Restraints and challenges that are expected to be encountered during the forecast period.
Anticipated opportunities for growth and development
Technological advancements and projected developments in the market
Consumer spending trends and dynamics
Shifts in consumer preferences and behaviors.
The current state of raw materials and trends in supply versus pricing
Regulatory landscape and expected changes or developments.
The existing capacity in the market and any expected additions or expansions up to the end of the forecast period.
To assess the market impact of these parameters, we assign weights to each one and utilize weighted average analysis. This process allows us to quantify their influence on the market and derive an expected growth rate for the forecasted period. By considering these various factors and applying a weighted analysis approach, we strive to provide accurate and reliable market forecasts.
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