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Global Memory Packaging Market to reach USD 34.3 billion by 2027

Global Memory Packaging Market to reach USD 34.3 billion by 2027

Product Code: CMP-39529771
Publish Date: 11-07-2021
Page: 200

Global Memory Packaging Market is valued at approximately USD 23.61 billion in 2020 and is anticipated to grow with a healthy growth rate of more than 5.5 % over the forecast period 2021-2027. Memory modules are made up of small semiconductor chips that need to be packaged in a way that allows them to be easily integrated into the rest of the system. To ensure that the modules perform properly, memory integrated circuits are placed according to specifications. Growing investments by several governments in semiconductor industry is propelling the market growth. For instance, to fund the second phase of the National IC Investment Fund 2030, the Chinese government raised between USD 23 and 30 billion. Also, the market’s manufacturers are expanding their production facilities. In South Korea, for example, in May 2021, SK Hynix Inc. is increased its semiconductor packaging and inspection facility capacity. Such innovations are likely to help existing firms increase their opportunities while reducing competitors’ advantages in the market under consideration. According to an article published by SK Hynix Inc., companies can no longer keep up with 3D NAND demand, and must expand their manufacturing capacity. In order to satisfy the increased demand, numerous corporations are expanding their manufacturing operations. Due to all of the above factors, the market may become highly competitive during the forecast period. However, harsh reliability requirements in the automotive environment may impede market growth over the forecast period of 2021-2027.

The regional analysis of the global Memory Packaging Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America, and Rest of the World (ROW). Asia Pacific is the leading region across the world in terms of market share due to rising investment in the semiconductor industry in the region. Whereas North America is also anticipated to exhibit the highest growth rate over the forecast period 2021-2027, due to the presence and availability of global brands across the region.

Major market player included in this report are:
Tianshui Huatian Technology Co. Ltd
Hana Micron Inc.
Lingsen precision industries Ltd
Formosa Advanced Technologies Co. Ltd
Advanced Semiconductor Engineering Inc.
Amkor Technology Inc.
Powertech Technology Inc.
Jiangsu Changjiang Electronics Technology Co. Ltd
Powertech Technology Inc.
King Yuan Electronics Corp. Ltd
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Platform:
Wafer-level Chip-scale Packaging(WLCSP)
Through-silicon Via (TSV)
By Application:
NAND Flash Packaging
NOR Flash Packaging
DRAM Packaging
Other Applications
By End use:
IT and Telecom
Consumer Electronics
Other End-user Industries
By Region:
North America

Asia Pacific
South Korea
Latin America
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2017, 2018-19
Base year – 2019-2020
Forecast period – 2021 to 2027.

Target Audience of the Global Memory Packaging Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers

Chapter 1. Executive Summary
1.1. Market Snapshot
1.2. Global & Segmental Market Estimates & Forecasts, 2019-2027 (USD Billion)
1.2.1. Memory Packaging Market , by Region, 2019-2027 (USD Billion)
1.2.2. Memory Packaging Market , by Platform, 2019-2027 (USD Billion)
1.2.3. Memory Packaging Market , by Application, 2019-2027 (USD Billion)
1.2.4. Memory Packaging Market , by End use, 2019-2027 (USD Billion)
1.3. Key Trends
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Memory Packaging Market Definition and Scope
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Scope of the Study
2.2.2. Industry Evolution
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Memory Packaging Market Dynamics
3.1. Memory Packaging Market Impact Analysis (2019-2027)
3.1.1. Market Drivers Emerging trend of autonomous driving and in-vehicle infotainment Increase in demand for smartphones
3.1.2. Market Restraint Harsh reliability requirements in the automotive environment
3.1.3. Market Opportunities Memory semiconductor business explosion
Chapter 4. Global Memory Packaging Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Suppliers
4.1.2. Bargaining Power of Buyers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.1.6. Futuristic Approach to Porter’s 5 Force Model (2018-2027)
4.2. PEST Analysis
4.2.1. Political
4.2.2. Economical
4.2.3. Social
4.2.4. Technological
4.3. Investment Adoption Model
4.4. Analyst Recommendation & Conclusion
Chapter 5. Global Memory Packaging Market , by Platform
5.1. Market Snapshot
5.2. Global Memory Packaging Market by Platform , Performance – Potential Analysis
5.3. Global Memory Packaging Market Estimates & Forecasts by Platform 2018-2027 (USD Billion)
5.4. Memory Packaging Market , Sub Segment Analysis
5.4.1. Flip-chip
5.4.2. Lead-frame
5.4.3. Wafer-level Chip-scale Packaging(WLCSP)
5.4.4. Through-silicon Via (TSV)
5.4.5. Wire-bond
Chapter 6. Global Memory Packaging Market , by Application
6.1. Market Snapshot
6.2. Global Memory Packaging Market by Application, Performance – Potential Analysis
6.3. Global Memory Packaging Market Estimates & Forecasts by Application 2018-2027 (USD Billion)
6.4. Memory Packaging Market , Sub Segment Analysis
6.4.1. NAND Flash Packaging
6.4.2. NOR Flash Packaging
6.4.3. DRAM Packaging
6.4.4. Other Applications
Chapter 7. Global Memory Packaging Market , by End use
7.1. Market Snapshot
7.2. Global Memory Packaging Market by End use, Performance – Potential Analysis
7.3. Global Memory Packaging Market Estimates & Forecasts by End use 2018-2027 (USD Billion)
7.4. Memory Packaging Market , Sub Segment Analysis
7.4.1. IT and Telecom
7.4.2. Consumer Electronics
7.4.3. Automotive
7.4.4. Other End-user Industries
Chapter 8. Global Memory Packaging Market , Regional Analysis
8.1. Memory Packaging Market , Regional Market Snapshot
8.2. North America Memory Packaging Market
8.2.1. U.S. Memory Packaging Market Platform breakdown estimates & forecasts, 2018-2027 Application breakdown estimates & forecasts, 2018-2027 End use breakdown estimates & forecasts, 2018-2027
8.2.2. Canada Memory Packaging Market
8.3. Europe Memory Packaging Market Snapshot
8.3.1. U.K. Memory Packaging Market
8.3.2. Germany Memory Packaging Market
8.3.3. France Memory Packaging Market
8.3.4. Spain Memory Packaging Market
8.3.5. Italy Memory Packaging Market
8.3.6. Rest of Europe Memory Packaging Market
8.4. Asia-Pacific Memory Packaging Market Snapshot
8.4.1. China Memory Packaging Market
8.4.2. India Memory Packaging Market
8.4.3. Japan Memory Packaging Market
8.4.4. Australia Memory Packaging Market
8.4.5. South Korea Memory Packaging Market
8.4.6. Rest of Asia Pacific Memory Packaging Market
8.5. Latin America Memory Packaging Market Snapshot
8.5.1. Brazil Memory Packaging Market
8.5.2. Mexico Memory Packaging Market
8.6. Rest of The World Memory Packaging Market
Chapter 9. Competitive Intelligence
9.1. Top Market Strategies
9.2. Company Profiles
9.2.1. Tianshui Huatian Technology Co. Ltd Key Information Overview Financial (Subject to Data Availability) Product Summary Recent Developments
9.2.2. Hana Micron Inc.
9.2.3. Lingsen precision industries Ltd
9.2.4. Formosa Advanced Technologies Co. Ltd
9.2.5. Advanced Semiconductor Engineering Inc.
9.2.6. Amkor Technology Inc.
9.2.7. Powertech Technology Inc.
9.2.8. Jiangsu Changjiang Electronics Technology Co. Ltd
9.2.9. Powertech Technology Inc.
9.2.10. King Yuan Electronics Corp. Ltd

Chapter 10. Research Application
10.1. Research Application
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.2. Research Attributes
10.3. Research Assumption

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Data Collection:
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To ensure the accuracy and reliability of our findings, we extensively leverage data science techniques, which help us minimize discrepancies and uncertainties in our analysis. We employ Data Science to clean and preprocess the data, ensuring its quality and reliability. This involves handling missing data, removing outliers, standardizing variables, and transforming data into suitable formats for analysis. The application of data science techniques enhances our accuracy, efficiency, and depth of analysis, enabling us to stay competitive in dynamic market environments.
Market Size Estimation:
Our proprietary data tools play a crucial role in deriving our market estimates and forecasts. Each study involves the creation of a unique and customized model. The model incorporates the gathered information on market dynamics, technology landscape, application development, and pricing trends. AI techniques, such as machine learning and deep learning, aid us to analyze patterns within the data to identify correlations, trends, and relationships. By recognizing patterns in consumer behavior, purchasing habits, or market dynamics, our AI algorithms aid us in more precise estimations of market size. These factors are simultaneously analyzed within the model, allowing for a comprehensive assessment. To quantify their impact over the forecast period, correlation, regression, and time series analysis are employed.
To estimate and validate the market size, we employ both top-down and bottom-up approaches. The preference is given to a bottom-up approach, where key regional markets are analyzed as separate entities. This data is then integrated to obtain global estimates. This approach is crucial as it provides a deep understanding of the industry and helps minimize errors.
In our forecasting process, we consider various parameters such as economic tools, technological analysis, industry experience, and domain expertise. By taking all these factors into account, we strive to produce accurate and reliable market forecasts. When forecasting, we take into consideration several parameters, which include:
Market driving trends and favorable economic conditions
Restraints and challenges that are expected to be encountered during the forecast period.
Anticipated opportunities for growth and development
Technological advancements and projected developments in the market
Consumer spending trends and dynamics
Shifts in consumer preferences and behaviors.
The current state of raw materials and trends in supply versus pricing
Regulatory landscape and expected changes or developments.
The existing capacity in the market and any expected additions or expansions up to the end of the forecast period.
To assess the market impact of these parameters, we assign weights to each one and utilize weighted average analysis. This process allows us to quantify their influence on the market and derive an expected growth rate for the forecasted period. By considering these various factors and applying a weighted analysis approach, we strive to provide accurate and reliable market forecasts.
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