Global Outsourced Semiconductor Assembly and Test Services Market is valued approximately USD 36.26 billion in 2022 and is anticipated to grow with a healthy growth rate of more than 8.32% over the forecast period 2023-2030. Third-party suppliers that offer integrated circuit device testing, assembly, and packaging services are referred to as outsourced semiconductor assembly and test (OSAT) vendors. By providing these services, end users and semiconductor foundries can more easily communicate.
The increased use of these services by semiconductor device manufacturers globally is the main factor fueling the OSAT market’s expansion. The rising demand for consumer electronics, improvements in next-generation electric vehicles, and the crucial function of semiconductor devices in industrial automation and smart production can all be credited for this increase.

For further analysis on the study, request a sample copy
Furthermore, as 5G, IoT, AI, and other cutting-edge technologies advance and are integrated into digital consumer electronics and wearables, there is a growing preference for advanced packaging technology as chip functional requirements change. The demand for multi-functional, highly integrated, high-performance, low-cost chips is also increasing. The increase of consumer electronics and linked devices, as well as corporate emphasis on quality enhancement and end-to-end testing solutions, all contribute to this growth. The OSAT industry is also anticipated to profit from the fabless market participants’ expanding market share in IC sales. Demand has been further fueled by encouraging government assistance for semiconductor manufacture on a global scale.
For instance, the Indian government proposed a revision to its current plan in October 2022, under which qualified applicants would receive financial help equal to 50% (up from 30%) of CAPEX. The Taiwanese government announced its five-year plan to invest USD 54.15 million in the semiconductor sector in 2020 in order to build the necessary personnel for R&D. However, during the forecast period of 2023–2030, the high cost of Outsourced Semiconductor Assembly and Test Services restrains market growth.
By Service Type, the market is studied under Assembly & Packaging and Testing. Among these Assembly & Packaging dominates the market with a 79.29% share in 2022. This can be attributed to the wide demand for fast semiconductor assembly due to increase in adoption of Consumer Electronics.

By Application, the market is studied under Telecommunication, Consumer Electronics, Industrial Electronics, Automotive, Aerospace & Defense and Others. Among these Telecommunications holds a dominant share of 30% in 2022. This can be attributed to increase in Internet penetration and Cellphone adoption.

Global Outsourced Semiconductor Assembly and Test (OSAT) Services Market is studied under 5 major regions namely, North America, Europe, Latin America, Asia Pacific and Middle East & Africa. The Asia Pacific region stands out as the dominating and fastest-growing hub for the Outsourced Semiconductor Assembly and Test Services Market. Countries such as Taiwan, China, and Southeast Asian nations have become epicenters in semiconductor manufacturing and testing activities. The region benefits from a well-established supply chain, technological expertise, and cost advantages. Taiwan hosts major OSAT companies and is a global leader in advanced packaging technologies.
The rapid adoption of new semiconductor nodes, the proliferation of consumer electronics, and supportive government policies make Asia Pacific the primary driver of growth in the OSAT Market. Europe, while not as dominant as the Asia Pacific plays a crucial role in the global OSAT Market. The region boasts a strong semiconductor ecosystem, with a focus on research and development. European OSAT providers contribute to the market by offering specialized services and collaborating with semiconductor companies globally. The automotive and industrial sectors drive the demand for semiconductor solutions and Europe’s commitment to innovation positions it as an important player in shaping the future landscape of the OSAT Market.

Major market player included in this report are:
Unisem Group
Powertech Technology, Inc.
Amkor Technology Inc.
ASE Technology Holding Co.
ChipMOS Technologies Inc.
King Yuan Electronics Co., Ltd.
JCET Group Co., Ltd.
Hana Micron Inc.
UTAC Holdings Ltd.
Lingsen Precision Industries, Ltd.
Recent Developments in the Market:
Ø In May 2021, Samsung Electronics Co., Ltd. has introduced I-Cube4, a cutting-edge semiconductor packaging method. The most recent technology has led to the more rapid and efficient development of semiconductors by adopting an innovative chip-packing strategy.
Ø In October 2020, The National Kaohsiung University of Science and Technology (NKUST) and ASE Group have worked together to build a campus-based talent development facility for semiconductor assembly and test (SAT). The “Ministry of Education (MOE)” has taken the initiative to implement training at vocational and technical schools.
Global Outsourced Semiconductor Assembly and Test Services Market Report Scope:
ü Historical Data – 2020 – 2021
ü Base Year for Estimation – 2022
ü Forecast period – 2023-2030
ü Report Coverage – Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
ü Segments Covered – Service Type, Application, Region
ü Regional Scope – North America; Europe; Asia Pacific; Latin America; Middle East & Africa
ü Customization Scope – Free report customization (equivalent up to 8 analyst’s working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Service Type:
Assembly & Packaging
Testing
By Application:
Telecommunication
Consumer Electronics
Industrial Electronics
Automotive
Aerospace & Defense
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Middle East & Africa
Saudi Arabia
South Africa
Rest of Middle East & Africa