Global Fan Out Wafer Level Packaging Market Size Study, by Application (Analog and Mixed IC, Wireless Connectivity, Logic and Memory IC, MEMS and Sensors, CMOS Image Sensors) by Regional Forecasts 2017-2025

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Global Fan Out Wafer Level Packaging Market valued approximately USD xx billion in 2016 is anticipated to grow with a healthy growth rate of more than xx% over the forecast period 2017-2025 Increase in wafer size, the global semiconductor industry witnessed an increase in the size of silicon wafers, from 100 mm to 300 mm, which minimizes the cost of manufacturing semiconductor ICs by 20%-25%. At present, the industry predominantly uses 300 mm wafers to manufacturer ICs. This trend is expected to maintain its momentum during the forecast period as companies are investing a substantial amount in the construction and upgradation of fabs to manufacture 300 mm wafers. High adoption of semiconductor ICs in automobiles, the automation and electrification of automobiles has increased the need for semiconductor wafers. Several types of semiconductor ICs are used in automotive products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, car navigation and display, infotainment, collision detection technology, and automated driving. This will propel the demand for WLP solutions for IC packaging in the automobile segment.

Global Fan Out Wafer Level Packaging Market to reach USD xxx billion by 2025.The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Application:

  • Analog and mixed IC
  • Wireless connectivity
  • Logic and memory IC
  • MEMS and sensors
  • CMOS image sensors

By Regions:

  • North America
    • U.S.
    • Canada
  • Europe
    • UK
    • Germany
  • Asia Pacific
    • China
    • India
    • Japan
  • Latin America
    • Brazil
    • Mexico
  • Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2015

Base year – 2016

Forecast period – 2017 to 2025

Some of the key manufacturers involved in the market are STATS Chip PAC, TSMC, Texas Instruments, SEMES, Rudolph Technologies, SUSS Micro Tec., Acquisitions and effective mergers are some of the strategies adopted by the key manufacturers. New product launches and continuous technological innovations are the key strategies adopted by the major players.

Target Audience of the Global Fan Out Wafer Level Packaging Market in Market Study:

  • Key Consulting Companies & Advisors
  • Large, medium-sized, and small enterprises
  • Venture capitalists
  • Value-Added Resellers (VARs)
  • Third-party knowledge providers
  • Investment bankers
  • Investors

Chapter 1.           Global Fan Out Wafer Level Packaging Market Definition and Scope

1.1.         Research Objective

1.2.         Market Definition

1.3.         Scope of The Study

1.4.         Years Considered for The Study

1.5.         Currency Conversion Rates

1.6.         Report Limitation

Chapter 2.           Research Methodology

2.1.         Research Process

2.1.1.     Data Mining

2.1.2.     Analysis

2.1.3.     Market Estimation

2.1.4.     Validation

2.1.5.     Publishing

2.2.         Research Assumption

Chapter 3.           Executive Summary

3.1.         Global & Segmental Market Estimates & Forecasts, 2015-2025 (USD Billion)

3.2.         Key Trends

Chapter 4.           Global Fan Out Wafer Level Packaging Market Dynamics

4.1.         Growth Prospects

4.1.1.     Drivers

4.1.2.     Restraints

4.1.3.     Opportunities

4.2.         Industry Analysis

4.2.1.     Porter’s 5 Force Model

4.2.2.     PEST Analysis

4.2.3.     Value Chain Analysis

4.3.         Analyst Recommendation & Conclusion

Chapter 5.           Global Fan Out Wafer Level Packaging Market, By Application

5.1.         Market Snapshot

5.2.         Market Performance – Potential Model

5.3.         Global Fan Out Wafer Level Packaging Market, Sub Segment Analysis

5.3.1.     Analog and Mixed IC

5.3.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)

5.3.1.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)

5.3.2.     Wireless Connectivity

5.3.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)

5.3.2.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)

5.3.3.     Logic and Memory IC

5.3.3.1. Market estimates & forecasts, 2015-2025 (USD Billion)

5.3.3.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)

5.3.4.     MEMS and Sensors

5.3.4.1. Market estimates & forecasts, 2015-2025 (USD Billion)

5.3.4.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)

5.3.5.     CMOS Image Sensors

5.3.5.1. Market estimates & forecasts, 2015-2025 (USD Billion)

5.3.5.2. Regional breakdown estimates & forecasts, 2015-2025 (USD Billion)

Chapter 6.           Global Fan Out Wafer Level Packaging Market, by Regional Analysis

6.1.         Fan Out Wafer Level Packaging Market, Regional Market Snapshot (2015-2025)

6.2.         North America Fan Out Wafer Level Packaging Market Snapshot

6.2.1.     U.S.

6.2.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.2.1.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.2.2.     Canada

6.2.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.2.2.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.3.         Europe Fan Out Wafer Level Packaging Market Snapshot

6.3.1.     U.K.

6.3.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.3.1.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.3.2.     Germany

6.3.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.3.2.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.3.3.     France

6.3.3.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.3.3.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.3.4.     Rest of Europe

6.3.4.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.3.4.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.4.         Asia Fan Out Wafer Level Packaging Market Snapshot

6.4.1.     China

6.4.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.4.1.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.4.2.     India

6.4.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.4.2.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.4.3.     Japan

6.4.3.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.4.3.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.4.4.     Rest of Asia Pacific

6.4.4.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.4.4.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.5.         Latin America Fan Out Wafer Level Packaging Market Snapshot

6.5.1.     Brazil

6.5.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.5.1.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.5.2.     Mexico

6.5.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.5.2.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.6.         Rest of The World

6.6.1.     South America

6.6.1.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.6.1.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

6.6.2.     Middle East and Africa

6.6.2.1. Market estimates & forecasts, 2015-2025 (USD Billion)

6.6.2.2. Application breakdown estimates & forecasts, 2015-2025 (USD Billion)

Chapter 7.           Competitive Intelligence

7.1.         Company Market Share (Subject to Data Availability)

7.2.         Top Market Strategies

7.3.         Company Profiles

7.3.1.     STATS ChipPAC

7.3.1.1. Overview

7.3.1.2. Financial (Subject to Data Availability)

7.3.1.3. Product Summary

7.3.1.4. Recent Developments

7.3.2.     . TSMC

7.3.3.     Texas Instruments

7.3.4.     Rudolph Technologies

7.3.5.     SEMES

7.3.6.     SUSS Micro Tec

7.3.7.     STMicroelectronics

7.3.8.     Ultratech (VEECO)

The research for global Fan Out Wafer Level Packaging market focuses deeply on the entire value chain of the market. However, the market size estimates are purely based on the consumer side of the value chain wherein the market sizes have been calculated by analyzing the average demand for Fan Out Wafer Level Packaging market across various applications.

The revenue for global Fan Out Wafer Level Packaging market is calculated as sum market sizes of different segments such as application, and regions. Further, some other key data points considered to calculate the revenue for global Fan Out Wafer Level Packaging market includes:

  • Revenues from key companies
  • Key company market share analysis
  • Consumer spending analysis
  • Regional export and import analysis
  • Sales revenue generated by various applications in different geographies

An extensive primary and secondary research has been conducted on key industry people, through questionnaires, telephonic conversations, email conversations, and interviews to verify the market estimations. Various government websites/portals and paid data sources are considered as a key source of secondary research.

We utilize a combination of bottom-up & top-down methodology for market estimations & forecasts. Additionally, we employ data triangulation techniques to verify each of the market estimates and forecasts through primary interviews and feedbacks.

All the estimates are derived from simulation models which is our proprietary technique. Each of these models is different from each other are a combination of correlation, regression and time series analysis. Each of these models is basically divided into two types namely economic and technological. Economical models are used to determine short-term market estimates and technological models are used for long-term estimates & forecasts.  


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