Global Thin Wafer Market to reach USD 12.4 billion by 2027.

Global Thin Wafer Market Size study, by Wafer size (125 mm, 200 mm, 300 mm), by Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), by Technology (Grinding, Polishing, Dicing), by Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic, Others) and Regional Forecasts 2020-2027
Product Code:  EESAC_52857376
Chapter 1.	Executive Summary 
1.1.	Market Snapshot
1.2.	Global & Segmental Market Estimates & Forecasts, 2018-2027 (USD Billion)
1.2.1.	Thin Wafer Market, by Region, 2018-2027 (USD Billion)
1.2.2.	Thin Wafer Market, by Wafer Size, 2018-2027 (USD Billion)
1.2.3.	Thin Wafer Market, by Process, 2018-2027 (USD Billion)
1.2.4.	Thin Wafer Market, by Technology, 2018-2027 (USD Billion)
1.2.5.	Thin Wafer Market, by Application, 2018-2027 (USD Billion)
1.3.	Key Trends
1.4.	Estimation Methodology
1.5.	Research Assumption
Chapter 2.	Global Thin Wafer Market Definition and Scope 
2.1.	Objective of the Study
2.2.	Market Definition & Scope
2.2.1.	Scope of the Study
2.2.2.	Industry Evolution
2.3.	Years Considered for the Study
2.4.	Currency Conversion Rates
Chapter 3.	Global Thin Wafer Market Dynamics	
3.1.	Thin Wafer Market Impact Analysis (2018-2027)
3.1.1.	Market Drivers
3.1.2.	Market Challenges
3.1.3.	Market Opportunities
Chapter 4.	Global Thin Wafer Market Industry Analysis
4.1.	Porter’s 5 Force Model
4.1.1.	Bargaining Power of Suppliers
4.1.2.	Bargaining Power of Buyers
4.1.3.	Threat of New Entrants
4.1.4.	Threat of Substitutes
4.1.5.	Competitive Rivalry
4.1.6.	Futuristic Approach to Porter’s 5 Force Model (2017-2027)
4.2.	PEST Analysis
4.2.1.	Political 
4.2.2.	Economical
4.2.3.	Social 
4.2.4.	Technological 
4.3.	Investment Adoption Model
4.4.	Analyst Recommendation & Conclusion
Chapter 5.	Global Thin Wafer Market, by Wafer Size
5.1.	Market Snapshot 
5.2.	Global Thin Wafer Market by Wafer Size, Performance - Potential Analysis
5.3.	Global Thin Wafer Market Estimates & Forecasts by Wafer Size 2017-2027 (USD Billion)
5.4.	Thin Wafer Market, Sub Segment Analysis
5.4.1.	 125 mm
5.4.2.	200 mm
5.4.3.	300 mm
Chapter 6.	Global Thin Wafer Market, By Process
6.1.	Market Snapshot 
6.2.	Global Thin Wafer Market by Process, Performance - Potential Analysis
6.3.	Global Thin Wafer Market Estimates & Forecasts by Process 2017-2027 (USD Billion)
6.4.	Thin Wafer Market, Sub Segment Analysis
6.4.1.	 Temporary Bonding & Debonding
6.4.2.	Carrier-less/Taiko Process
Chapter 7.	 Global Thin Wafer Market, By Technology
7.1.	Market Snapshot 
7.2.	Global Thin Wafer Market by Technology, Performance - Potential Analysis
7.3.	Global Thin Wafer Market Estimates & Forecasts by Technology 2017-2027 (USD Billion)
7.4.	Thin Wafer Market, Sub Segment Analysis
7.4.1.	 Grinding
7.4.2.	Polishing
7.4.3.	Dicing
Chapter 8.	Global Thin Wafer Market, by Application         
8.1.	Market Snapshot 
8.2.	Global Thin Wafer Market by Application, Performance - Potential Analysis
8.3.	Global Thin Wafer Market Estimates & Forecasts by Application 2017-2027 (USD Billion)
8.4.	Thin Wafer Market, Sub Segment Analysis
8.4.1.	 
8.4.2.	Memory
8.4.3.	RF Devices
8.4.4.	LED
8.4.5.	Interposer
8.4.6.	Logic
8.4.7.	Others
Chapter 9.	Global Thin Wafer Market, Regional Analysis
9.1.	Thin Wafer Market, Regional Market Snapshot 
9.2.	North America Thin Wafer Market 
9.2.1.	U.S. Thin Wafer Market
9.2.1.1.	 Wafer size breakdown estimates & forecasts, 2017-2027 
9.2.1.2.	 Process breakdown estimates & forecasts, 2017-2027 
9.2.1.3.	Technology breakdown estimates & forecasts, 2017-2027 
9.2.1.4.	 Application breakdown estimates & forecasts, 2017-2027 
9.2.2.	Canada Thin Wafer Market
9.3.	Europe Thin Wafer Market Snapshot
9.3.1.	U.K. Thin Wafer Market 
9.3.2.	Germany Thin Wafer Market
9.3.3.	France Thin Wafer Market
9.3.4.	Spain Thin Wafer Market
9.3.5.	Italy Thin Wafer Market
9.3.6.	Rest of Europe Thin Wafer Market
9.4.	Asia-Pacific Thin Wafer Market Snapshot
9.4.1.	China Thin Wafer Market 
9.4.2.	India Thin Wafer Market 
9.4.3.	Japan Thin Wafer Market
9.4.4.	Australia Thin Wafer Market
9.4.5.	South Korea Thin Wafer Market
9.4.6.	Rest of Asia Pacific Thin Wafer Market
9.5.	Latin America Thin Wafer Market Snapshot
9.5.1.	Brazil Thin Wafer Market
9.5.2.	Mexico Thin Wafer Market
9.6.	Rest of The World Thin Wafer Market

Chapter 10.	Competitive Intelligence
10.1.	Top Market Strategies
10.2.	Company Profiles
10.2.1.	 3M Company
10.2.1.1.	Key Information
10.2.1.2.	Overview
10.2.1.3.	Financial (Subject to Data Availability)
10.2.1.4.	Product Summary
10.2.1.5.	Recent Developments
10.2.2.	Brewer Science, Inc.
10.2.3.	 EV Group
10.2.4.	 GlobalWafers Co., Ltd
10.2.5.	 My-Chip Production GmbH
10.2.6.	 Polishing Corporation of America
10.2.7.	 Siltronic AG
10.2.8.	 Sil'tronix Silicon Technologies
10.2.9.	 ULVAC GmbH
10.2.10.	 Virginia Semiconductor Inc.
Chapter 11.	Research Process
11.1.	Research Process
11.1.1.	Data Mining
11.1.2.	Analysis
11.1.3.	Market Estimation
11.1.4.	Validation
11.1.5.	Publishing
11.2.	Research Attributes
11.3.	Research Assumption

Global Thin Wafer Market is valued approximately USD 7.1 billion in 2019 and is anticipated to grow with a healthy growth rate of more than 7.2 % over the forecast period 2020-2027. A thin wafer, also known as a substrate or portion of semiconductor material, is an electronic component used in integrated circuits (ICs) for manufacturing and in solar cells, as well as in photovoltaics. Wafer is used as a powerful substratum in microcontroller devices and undergoes processes of etching, deposition, and iron implant. The market is driven by rising adoption of MEMS technology in portable health tracking devices, increasing emphasis on e-learning in the midst of COVID-19 drives demand for smartphones, tablets , laptops, and telecommunication systems, decreasing electronic device sizes, rising markets for smartphones and consumer electronics, high material saving. The key players of global Thin Wafer market have adopted various strategies to gain competitive advantage including product launch, mergers and acquisition, partnerships and agreements, investment, funding and others. For instance, In June 2020, in response to the growing demand for such wafers in applications such as data centers and 5 G wireless networks, Siltronic AG invested in an epitaxial reactor to increase its GaN-on-Si (Gallium Nitride-on-Silicon) wafer portfolio production power. Under high power densities, GaN technology promotes efficient energy delivery. However, efficiency maintenance is the major issue for thin wafers and would restrain growth of market.

The regional analysis of global Thin Wafer Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America and Rest of the World. North America is the leading/significant region across the world in terms of laptops, and telecommunication systems, decreasing electronic device sizes, rising markets for smartphones and consumer electronics, high material saving. Whereas, Asia-Pacific is also anticipated to exhibit highest growth rate / CAGR over the forecast period 2020-2027. Factors Rising adoption of MEMS technology in portable health tracking devices, increasing emphasis on e-learning in the midst of COVID-19 drives demand for smartphones, tablets would create lucrative growth prospects for the Thin Wafer Market across Asia-Pacific region.

Major market player included in this report are:
3M Company
Brewer Science, Inc.
EV Group
GlobalWafers Co., Ltd
My-Chip Production GmbH
Polishing Corporation of America
Siltronic AG
Sil’tronix Silicon Technologies
ULVAC GmbH
Virginia Semiconductor Inc.

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Wafer size:
125 mm
200 mm
300 mm
By Process:
Temporary Bonding & Debonding
Carrier-less/Taiko Process
By Technology:
Grinding
Polishing
Dicing
By Application:
Memory
RF Devices
LED
Interposer
Logic
Others
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE

Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2017, 2018
Base year – 2019
Forecast period – 2020 to 2027

Target Audience of the Global Thin Wafer Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors


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