- July 15, 2020
- Category: Electronics, Electronics Systems and Components
Global Thin Wafer Market Size study, by Wafer size (125 mm, 200 mm, 300 mm), by Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), by Technology (Grinding, Polishing, Dicing), by Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic, Others) and Regional Forecasts 2020-2027
Chapter 1. Executive Summary 1.1. Market Snapshot 1.2. Global & Segmental Market Estimates & Forecasts, 2018-2027 (USD Billion) 1.2.1. Thin Wafer Market, by Region, 2018-2027 (USD Billion) 1.2.2. Thin Wafer Market, by Wafer Size, 2018-2027 (USD Billion) 1.2.3. Thin Wafer Market, by Process, 2018-2027 (USD Billion) 1.2.4. Thin Wafer Market, by Technology, 2018-2027 (USD Billion) 1.2.5. Thin Wafer Market, by Application, 2018-2027 (USD Billion) 1.3. Key Trends 1.4. Estimation Methodology 1.5. Research Assumption Chapter 2. Global Thin Wafer Market Definition and Scope 2.1. Objective of the Study 2.2. Market Definition & Scope 2.2.1. Scope of the Study 2.2.2. Industry Evolution 2.3. Years Considered for the Study 2.4. Currency Conversion Rates Chapter 3. Global Thin Wafer Market Dynamics 3.1. Thin Wafer Market Impact Analysis (2018-2027) 3.1.1. Market Drivers 3.1.2. Market Challenges 3.1.3. Market Opportunities Chapter 4. Global Thin Wafer Market Industry Analysis 4.1. Porter’s 5 Force Model 4.1.1. Bargaining Power of Suppliers 4.1.2. Bargaining Power of Buyers 4.1.3. Threat of New Entrants 4.1.4. Threat of Substitutes 4.1.5. Competitive Rivalry 4.1.6. Futuristic Approach to Porter’s 5 Force Model (2017-2027) 4.2. PEST Analysis 4.2.1. Political 4.2.2. Economical 4.2.3. Social 4.2.4. Technological 4.3. Investment Adoption Model 4.4. Analyst Recommendation & Conclusion Chapter 5. Global Thin Wafer Market, by Wafer Size 5.1. Market Snapshot 5.2. Global Thin Wafer Market by Wafer Size, Performance - Potential Analysis 5.3. Global Thin Wafer Market Estimates & Forecasts by Wafer Size 2017-2027 (USD Billion) 5.4. Thin Wafer Market, Sub Segment Analysis 5.4.1. 125 mm 5.4.2. 200 mm 5.4.3. 300 mm Chapter 6. Global Thin Wafer Market, By Process 6.1. Market Snapshot 6.2. Global Thin Wafer Market by Process, Performance - Potential Analysis 6.3. Global Thin Wafer Market Estimates & Forecasts by Process 2017-2027 (USD Billion) 6.4. Thin Wafer Market, Sub Segment Analysis 6.4.1. Temporary Bonding & Debonding 6.4.2. Carrier-less/Taiko Process Chapter 7. Global Thin Wafer Market, By Technology 7.1. Market Snapshot 7.2. Global Thin Wafer Market by Technology, Performance - Potential Analysis 7.3. Global Thin Wafer Market Estimates & Forecasts by Technology 2017-2027 (USD Billion) 7.4. Thin Wafer Market, Sub Segment Analysis 7.4.1. Grinding 7.4.2. Polishing 7.4.3. Dicing Chapter 8. Global Thin Wafer Market, by Application 8.1. Market Snapshot 8.2. Global Thin Wafer Market by Application, Performance - Potential Analysis 8.3. Global Thin Wafer Market Estimates & Forecasts by Application 2017-2027 (USD Billion) 8.4. Thin Wafer Market, Sub Segment Analysis 8.4.1. 8.4.2. Memory 8.4.3. RF Devices 8.4.4. LED 8.4.5. Interposer 8.4.6. Logic 8.4.7. Others Chapter 9. Global Thin Wafer Market, Regional Analysis 9.1. Thin Wafer Market, Regional Market Snapshot 9.2. North America Thin Wafer Market 9.2.1. U.S. Thin Wafer Market 220.127.116.11. Wafer size breakdown estimates & forecasts, 2017-2027 18.104.22.168. Process breakdown estimates & forecasts, 2017-2027 22.214.171.124. Technology breakdown estimates & forecasts, 2017-2027 126.96.36.199. Application breakdown estimates & forecasts, 2017-2027 9.2.2. Canada Thin Wafer Market 9.3. Europe Thin Wafer Market Snapshot 9.3.1. U.K. Thin Wafer Market 9.3.2. Germany Thin Wafer Market 9.3.3. France Thin Wafer Market 9.3.4. Spain Thin Wafer Market 9.3.5. Italy Thin Wafer Market 9.3.6. Rest of Europe Thin Wafer Market 9.4. Asia-Pacific Thin Wafer Market Snapshot 9.4.1. China Thin Wafer Market 9.4.2. India Thin Wafer Market 9.4.3. Japan Thin Wafer Market 9.4.4. Australia Thin Wafer Market 9.4.5. South Korea Thin Wafer Market 9.4.6. Rest of Asia Pacific Thin Wafer Market 9.5. Latin America Thin Wafer Market Snapshot 9.5.1. Brazil Thin Wafer Market 9.5.2. Mexico Thin Wafer Market 9.6. Rest of The World Thin Wafer Market Chapter 10. Competitive Intelligence 10.1. Top Market Strategies 10.2. Company Profiles 10.2.1. 3M Company 10.2.1.1. Key Information 10.2.1.2. Overview 10.2.1.3. Financial (Subject to Data Availability) 10.2.1.4. Product Summary 10.2.1.5. Recent Developments 10.2.2. Brewer Science, Inc. 10.2.3. EV Group 10.2.4. GlobalWafers Co., Ltd 10.2.5. My-Chip Production GmbH 10.2.6. Polishing Corporation of America 10.2.7. Siltronic AG 10.2.8. Sil'tronix Silicon Technologies 10.2.9. ULVAC GmbH 10.2.10. Virginia Semiconductor Inc. Chapter 11. Research Process 11.1. Research Process 11.1.1. Data Mining 11.1.2. Analysis 11.1.3. Market Estimation 11.1.4. Validation 11.1.5. Publishing 11.2. Research Attributes 11.3. Research Assumption
Global Thin Wafer Market is valued approximately USD 7.1 billion in 2019 and is anticipated to grow with a healthy growth rate of more than 7.2 % over the forecast period 2020-2027. A thin wafer, also known as a substrate or portion of semiconductor material, is an electronic component used in integrated circuits (ICs) for manufacturing and in solar cells, as well as in photovoltaics. Wafer is used as a powerful substratum in microcontroller devices and undergoes processes of etching, deposition, and iron implant. The market is driven by rising adoption of MEMS technology in portable health tracking devices, increasing emphasis on e-learning in the midst of COVID-19 drives demand for smartphones, tablets , laptops, and telecommunication systems, decreasing electronic device sizes, rising markets for smartphones and consumer electronics, high material saving. The key players of global Thin Wafer market have adopted various strategies to gain competitive advantage including product launch, mergers and acquisition, partnerships and agreements, investment, funding and others. For instance, In June 2020, in response to the growing demand for such wafers in applications such as data centers and 5 G wireless networks, Siltronic AG invested in an epitaxial reactor to increase its GaN-on-Si (Gallium Nitride-on-Silicon) wafer portfolio production power. Under high power densities, GaN technology promotes efficient energy delivery. However, efficiency maintenance is the major issue for thin wafers and would restrain growth of market.
The regional analysis of global Thin Wafer Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America and Rest of the World. North America is the leading/significant region across the world in terms of laptops, and telecommunication systems, decreasing electronic device sizes, rising markets for smartphones and consumer electronics, high material saving. Whereas, Asia-Pacific is also anticipated to exhibit highest growth rate / CAGR over the forecast period 2020-2027. Factors Rising adoption of MEMS technology in portable health tracking devices, increasing emphasis on e-learning in the midst of COVID-19 drives demand for smartphones, tablets would create lucrative growth prospects for the Thin Wafer Market across Asia-Pacific region.
Major market player included in this report are:
Brewer Science, Inc.
GlobalWafers Co., Ltd
My-Chip Production GmbH
Polishing Corporation of America
Sil’tronix Silicon Technologies
Virginia Semiconductor Inc.
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Wafer size:
Temporary Bonding & Debonding
Rest of the World
Furthermore, years considered for the study are as follows:
Historical year – 2017, 2018
Base year – 2019
Forecast period – 2020 to 2027
Target Audience of the Global Thin Wafer Market in Market Study:
Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Value-Added Resellers (VARs)
Third-party knowledge providers