Global Molded Interconnect Devices (MID) Market to reach USD 2864.1 billion by 2026.

Global Molded Interconnect Devices (MID) Market Size study, by Process (LDS, 2-Shot Molding, Film Techniques), by Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), by Industry and by Regional Forecasts 2019-2026
Product Code:  OIRIA_18441664
Chapter 1. Executive Summary 
1.1. Market Snapshot
1.2. Key Trends
1.3. Global & Segmental Market Estimates & Forecasts, 2016-2026 (USD Billion)
1.3.1. Molded Interconnect Devices (MID) Market, by Process, 2016-2026 (USD Billion)
1.3.2. Molded Interconnect Devices (MID) Market, by Product, 2016-2026 (USD Billion)
1.3.3. Molded Interconnect Devices (MID) Market, by Industry, 2016-2026 (USD Billion)
1.3.4. Molded Interconnect Devices (MID) Market, by Region, 2016-2026 (USD Billion)
1.4. Estimation Methodology
1.5. Research Assumption
Chapter 2. Global Molded Interconnect Devices (MID) Market Definition and Scope 
2.1. Objective of the Study
2.2. Market Definition & Scope
2.2.1. Industry Evolution
2.2.2. Scope of the Study
2.3. Years Considered for the Study
2.4. Currency Conversion Rates
Chapter 3. Global Molded Interconnect Devices (MID) Market Dynamics 
3.1. See Saw Analysis
3.1.1. Market Drivers
3.1.2. Market Challenges
3.1.3. Market Opportunities
Chapter 4. Global Molded Interconnect Devices (MID) Market Industry Analysis
4.1. Porter’s 5 Force Model
4.1.1. Bargaining Power of Buyers
4.1.2. Bargaining Power of Suppliers
4.1.3. Threat of New Entrants
4.1.4. Threat of Substitutes
4.1.5. Competitive Rivalry
4.1.6. Futuristic Approach to Porter’s 5 Force Model
4.2. PEST Analysis
4.2.1. Political Scenario
4.2.2. Economic Scenario
4.2.3. Social Scenario
4.2.4. Technological Scenario
4.3. Key Buying Criteria (On Demand)
4.4. Regulatory Framework (On Demand)
4.5. Investment Vs Adoption Scenario (On Demand)
4.6. Analyst Recommendation & Conclusion
Chapter 5. Global Molded Interconnect Device (MID) Market, By Process
5.1. Market Snapshot 
5.1. Market Performance - Potential Model
5.2. Global Molded Interconnect Device (MID) Market, Sub Segment Analysis
5.2.1. Laser Direct Structuring 
5.2.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
5.2.1.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
5.2.2. 2-Shot Molding
5.2.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
5.2.2.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
5.2.3. Film Techniques
5.2.3.1. Market estimates & forecasts, 2016-2026 (USD Billion)
5.2.3.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)

Chapter 6. Global Molded Interconnect Device (MID) Market, By Product
6.1. Market Snapshot 
6.2. Market Performance - Potential Model
6.3. Global Molded Interconnect Device (MID) Market, Sub Segment Analysis
6.3.1. Antennae and Connectivity Modules 
6.3.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
6.3.1.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
6.3.2. Sensors
6.3.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
6.3.2.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
6.3.3. Connectors and Switches
6.3.3.1. Market estimates & forecasts, 2016-2026 (USD Billion)
6.3.3.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
6.3.4. Lighting
6.3.4.1. Market estimates & forecasts, 2016-2026 (USD Billion)
6.3.4.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
6.3.5. Others
6.3.5.1. Market estimates & forecasts, 2016-2026 (USD Billion)
6.3.5.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)

Chapter 7. Global Molded Interconnect Device (MID) Market, By Industry
7.1. Market Snapshot 
7.2. Market Performance - Potential Model
7.3. Global Molded Interconnect Device (MID) Market, Sub Segment Analysis
7.3.1. Telecommunications 
7.3.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
7.3.1.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
7.3.2. Consumer Electronics
7.3.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
7.3.2.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
7.3.3. Automotive
7.3.3.1. Market estimates & forecasts, 2016-2026 (USD Billion)
7.3.3.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
7.3.4. Medical
7.3.4.1. Market estimates & forecasts, 2016-2026 (USD Billion)
7.3.4.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)
7.3.5. Industrial
7.3.5.1. Market estimates & forecasts, 2016-2026 (USD Billion)
7.3.5.2. Regional breakdown estimates & forecasts, 2016-2026 (USD Billion)

Chapter 8. Global Molded Interconnect Device (MID) Market, by Regional Analysis
8.1. Molded Interconnect Device (MID) Market, Regional Market Snapshot (2016-2026)
8.2. North America Molded Interconnect Device (MID) Market Snapshot
8.2.1. U.S.
8.2.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.2.1.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.2.1.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.2.1.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.2.2. Canada
8.2.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.2.2.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.2.2.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.2.2.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3. Europe Molded Interconnect Device (MID) Market Snapshot
8.3.1. U.K. 
8.3.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.3.1.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.1.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.1.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.2. Germany 
8.3.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.3.2.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.2.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.2.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.3. Rest of Europe
8.3.3.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.3.3.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.3.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.3.3.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4. Asia-Pacific Molded Interconnect Device (MID) Market Snapshot
8.4.1. China 
8.4.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.4.1.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.1.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.1.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.2. India 
8.4.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.4.2.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.2.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.2.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.3. Japan
8.4.3.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.4.3.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.3.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.3.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.4. Rest of Asia Pacific
8.4.4.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.4.4.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.4.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.4.4.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.5. Latin America Molded Interconnect Device (MID) Market Snapshot
8.5.1. Brazil 
8.5.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.5.1.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.5.1.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.5.1.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.5.2. Mexico 
8.5.2.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.5.2.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.5.2.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.5.2.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.6. Rest of The World 
8.6.1. Middle East and Africa
8.6.1.1. Market estimates & forecasts, 2016-2026 (USD Billion)
8.6.1.2. Process breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.6.1.3. Product breakdown estimates & forecasts, 2016-2026 (USD Billion)
8.6.1.4. Industry breakdown estimates & forecasts, 2016-2026 (USD Billion)

Chapter 9. Competitive Intelligence
9.1. Company Market Share (Subject to Data Availability)
9.2. Top Market Strategies
9.3. Company Profiles
9.3.1. Molex
9.3.1.1. Overview
9.3.1.2. Financial (Subject to Data Availability)
9.3.1.3. Product Summary
9.3.1.4. Recent Developments
9.3.2. LPKF Laser & Electronics
9.3.3. TE Connectivity
9.3.4. HARTING
9.3.5. Arlington Plating Company
9.3.6. Laser Micronics
9.3.7. Teprosa
9.3.8. Axon Cable
9.3.9. S2P
9.3.10. Suzhou Cicor Technology Co. Ltd
9.3.11. JOHNAN
9.3.12. MID Solutions
9.3.13. 2E Mechatronic
9.3.14. Multiple Dimensions
9.3.15. LLC
9.3.16. MacDermid, Inc.
9.3.17. RTP Company
9.3.18. YOMURA

Chapter 10. Research Process
10.1. Research Process
10.1.1. Data Mining
10.1.2. Analysis
10.1.3. Market Estimation
10.1.4. Validation
10.1.5. Publishing
10.1.6. Research Assumption

Global Molded Interconnect Devices (MID) Market valued approximately USD 905.6 billion in 2018 is anticipated to grow with a healthy growth rate of more than 15.48% over the forecast period 2019-2026. Recent technological improvements in telecommunication and consumer applications. Increasing use of smartphones and trend of using smart wearable devices are the major factors driving the growth of the Global Molded Interconnect Devices (MID) Market. This device is connected to various internal parts like circuit boards, and cables, improving the circuitry and eliminating need of different combinations of components in the PCB circuits. Molded Interconnect Devices (MID) technology enables diminishment in size of the devices including smartphones and automotive light fixtures, it also reduces assembly time and space-saving circuitry. Unlike traditional PCB circuits, MID facilitate fewer parts requirement for assembly, aiding to the growth of the market. However, lack of widespread implementation, low awareness, and requirement of expertise for manufacturing, low number of vendors offering MID products are the major restraints to the market. A molded interconnect device (MID) are molded thermoplastic part having integrated electronic circuit traces. High temperature efficient thermoplastics and their structured metallization opens a new dimension of circuit designing to the electronics industry. This technology combines plastic substrate/housing with circuitry into a single part by selective metallization. The advantages of MID includes, design flexibility, high product reliability and reduces the requirement of auxiliary parts, this devices are Eco-friendly and recyclable, environmental benefits of the technology includes elimination of hazardous flame-retardant manufacturing process.
The regional analysis of Global Molded Interconnect Devices (MID) Market is considered for the key regions such as Asia Pacific, North America, Europe, Latin America and Rest of the World. North America is the leading/significant region across the world in terms of market share. Whereas, owing to the countries such as China, Japan, and India, Asia Pacific region is anticipated to exhibit higher growth rate / CAGR over the forecast period 2019-2026.

Some of the leading market players include
Molex
LPKF Laser & Electronics
TE Connectivity
HARTING
Arlington Plating Company
Laser Micronics
Teprosa
Axon Cable
S2P
Suzhou Cicor Technology Co. Ltd
JOHNAN
MID Solutions
2E Mechatronic
Multiple Dimensions
LLC
MacDermid, Inc.
RTP Company
YOMURA

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming eight years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within each of the regions and countries involved in the study. Furthermore, the report also caters the detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, the report shall also incorporate available opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Process:

Laser Direct Structuring
2-Shot Molding
Film Techniques

By Product:

Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting
Others

By Industry:

Telecommunications
Consumer Electronics
Automotive
Medical
Industrial

By Regions:

North America
U.S.
Canada
Europe
UK
Germany
Asia Pacific
China
India
Japan
Latin America
Brazil
Mexico
Rest of the World

Furthermore, years considered for the study are as follows:

Historical year – 2016, 2017
Base year – 2018
Forecast period – 2019 to 2026

Target Audience of the Global Molded Interconnect Devices (MID) Market in Market Study:

Key Consulting Companies & Advisors
Large, medium-sized, and small enterprises
Venture capitalists
Value-Added Resellers (VARs)
Third-party knowledge providers
Investment bankers
Investors


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