Global Circuit Material Market is valued USD 29.8 billion in 2016 is anticipated to grow USD 40.0 billion with the compounded annual growth of 3.8 % over the forecast period 2017-2025.

New York 25 Aug 2018, As per the new research study conducted by Bizwit Research & Consulting, Global Circuit Material Market industry is poised to raise USD 40.0 billion by 2025.  Substrate, Conducting material,and Outer Layer  are the main type of the Circuit Material Market. End Applications market is further segmented at the regional level. Regional penetration for each Application is derived from the macroeconomic factors such as Per-capita Income size, GDP, & International trade The regional level applications are further segmented into Enduser based on their usage in respective applications..

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Global Circuit Material Market Size study, by Material Class, by Substrate by Conducting Material by Outer Layer , By Application and by Regional Forecasts 2017-2025

The industry is seems to be fairly competitive Some of the key manufacturers involved in the market are – Isola Group, Taiflex Scientific Co.Ltd, Rogers Corporation, Eternal Material Co.Ltd, Jinan Guoji Technology Ltd, Dowdupont, ITECQ Corporation, Kingboard Laminates Holding Ltd, Shengyi Technology Co Ltd. Acquisitions and effective mergers are some of the strategies adopted by the key manufacturers. New product launches and continuous technological innovations are the key strategies adopted by the major players. Additionally, the fierce competitiveness has made these players spend in product developments to improve the customer’s requirements.

Key findings of the study:

  • Framework to ensure safety of workforce: a major market driver
  • Need Advanced software to improve programming: emerging market trend
  • The Americas dominated the global arc welding robots market with 40% share in 2017

Bizwit Research & Consulting LLP has considered following segments for the study:

 By Material Class:

  • Substrate
  • Conducting Material
  • Outer Layer

By Substrate:

  • Fiberglass-Epoxy
  • Paper- Phenolic
  • CEM
  • Polymide

By Conducting Material:

  • Copper
  • Other

By  Outer Layer:

  • Liquid Ink Photoimageable Solder Mask
  • Dry Film Photoimageable
  • Others

By Application:

  • Communication
  • Industrial Electronics
  • Automotive
  • Aerospace & Defense

Regional Outlook

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Rest of the World

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